An atmosphere furnace with an oxygen concentration of 20ppm and a maximum operating temperature of 600℃, suitable for high-temperature thermal treatment in an oxygenf-ree environment.
Features
Maximum operating temperatures of 360°C and 600°C, with oxygen concentrations below 20ppm, primarily applied in electronic component annealing, LTCC removal, glass substrate annealing, ceramic debinding, etc
High gas-tightness pressure chamber construction, short oxygen concentration reaching time, low N2 consumption
Maintaining high gas-tightness through magnetic sealing and a water-cooling mechanism to protect sealing components from thermal effects
Quick heating and cooling achievable, with adjustable heating and cooling rates
Standard equipped with waste liquid recovery devices to cool and recover gases
Liquid crystal touchscreen operation, with both automatic and manual operation modes
Safety:Equipped with door detection switch, temperature overheating preventer, oxygen concentration abnormality detection, nitrogen pressure detection, nitrogen flow detection, cooling water flow detection, leakage sensor, overcurrent leakage protection and other devices
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