Product Summary
Usage: Wafer curing
Features
Achieve a low-oxygen atmosphere through gas displacement
N2, Ar two gas pipelines
Equipped with imported oxygen concentration analyzer
Vacuum ovens with ceramic fiber ovens body ensures low oxygen concentration while effectively isolating high temperatures inside the ovens
Patented floating door structure
Water-cooled seal strip structure
Micro differential pressure exhaust safety valve ensures the safety of the micro positive pressure state inside the chamber
Exhaust duct equipped with cooling fan, automatic program operation
By introducing N2 or Ar gas, the air in the chamber is displaced, reducing the oxygen concentration
After the oxygen concentration drops to the set value, the heating-constant temperature-cooling operation automatically begins
Specifications
Catalog
Optional Items
Same Series Product
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